Odisha signs semiconductor manufacturing pact with Intel, 3DGS: Ashwini Vaishnaw
New Delhi: The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India, according to Union Minister for Electronics and Information Technology Ashwini Vaishnaw Friday. Vaishnaw congratulated the state government, Intel and...










































