Majhi, Vaishnaw to attend ground-breaking ceremony of advanced 3D chip packaging unit
Bhubaneswar: Odisha Chief Minister Mohan Charan Majhi and Union minister Ashwini Vaishnaw will attend the ground-breaking ceremony of heterogeneous integration packaging solutions (3D glass solutions), India's first advanced glass semiconductor packaging unit Sunday, an official said. Majhi, along with Vaishnaw, the Union Minister for Railways,...











































